Duane Boning: search on Z-Library

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1

[IEEE ESSCIRC 2013 - 39th European Solid State Circuits Conference - Bucharest, Romania (2013.09.16-2013.09.20)] 2013 Proceedings of the ESSCIRC (ESSCIRC) - A 12b 50MS/s 2.1mW SAR ADC with redundancy and digital background calibration

Chang, Albert H., Lee, Hae-Seung, Boning, Duane

Year:

2013

Language:

english

File:

PDF, 952 KB

english, 2013

2

Machine Learning in VLSI Computer-Aided Design || Machine Learning for VLSI Chip Testing and Semiconductor Manufacturing Process Monitoring and Improvement

Elfadel, Ibrahim M., Boning, Duane S., Li, Xin

Year:

2019

Language:

english

File:

PDF, 551 KB

english, 2019

3

Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation

Weng Hong Teh,, Boning, Duane S., Welsch, Roy E.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2015

Language:

english

File:

PDF, 4.36 MB

english, 2015

4

Machine Learning in VLSI Computer-Aided Design || A Preliminary Taxonomy for Machine Learning in VLSI CAD

Elfadel, Ibrahim M., Boning, Duane S., Li, Xin

Year:

2019

File:

PDF, 278 KB

2019

5

Application of Geographic Information Systems to Identify the Oversummering Regions of Blumeria graminis f. sp. tritici in China

Li, Boning, Cao, Xueren, Chen, Lin, Zhou, Yilin, Duan, Xiayu, Luo, Yong, Fitt, Bruce D. L., Xu, Xiangming, Song, Yuli, Wang, Baotong, Cao, Shiqin

Journal:

Year:

2013

Language:

english

File:

PDF, 6.49 MB

english, 2013

6

[IEEE 2009 IEEE Custom Integrated Circuits Conference (CICC) - San Jose, CA, USA (2009.09.13-2009.09.16)] 2009 IEEE Custom Integrated Circuits Conference - Measurement and analysis of contact plug resistance variability

Balakrishnan, Karthik, Boning, Duane

Year:

2009

Language:

english

File:

PDF, 835 KB

english, 2009

7

Characterizing STI CMP Processes with an STI Test Mask Having Realistic Geometric Shapes

Xie, Xiaolin, Park, Tae, Boning, Duane, Smith, Aaron, Allard, Paul, Patel, Neil

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 262 KB

english, 2004

8

Modeling Spin Coating over Topography and Uniformity Improvements through Fill Patterns for Advanced Packaging Technologies

Lang, Christopher I., Boning, Duane S.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2018

Language:

english

File:

PDF, 869 KB

english, 2018

9

[IEEE 2007 IEEE International Conference on Microelectronic Test Structures - Bunkyo-ku, Japan (2007.03.19-2007.03.22)] 2007 IEEE International Conference on Microelectronic Test Structures - Test Circuit for Study of CMOS Process Variation by Measurement of Analog Characteristics

Gettings, Karen M. G. V., Boning, Duane S.

Year:

2007

Language:

english

File:

PDF, 4.90 MB

english, 2007

10

A method for the accelerated simulation of micro-embossed topographies in thermoplastic polymers

Taylor, Hayden, Hale, Melinda, Lam, Yee Cheong, Boning, Duane

Journal:

Journal of Micromechanics and Microengineering

Year:

2010

Language:

english

File:

PDF, 1.78 MB

english, 2010

11

Wafer Nanotopography Effects on CMP: Experimental Validation of Modeling Methods

Lee, Brian, Boning, Duane S., Baylies, Winthrop, Poduje, Noel, Hester, Pat, Xia, Yong, Valley, John, Koliopoulus, Chris, Hetherington, Dale, Sun, HongJiang, Lacy, Michael

Journal:

MRS Proceedings

Year:

2001

Language:

english

File:

PDF, 188 KB

english, 2001

12

Modeling and Controlling Layout Dependent Variations in Semi-Additive Copper Electrochemical Plating

Lang, Christopher I., Boning, Duane S.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2019

File:

PDF, 3.57 MB

2019

13

Modeling and simulation of stamp deflections in nanoimprint lithography: Exploiting backside grooves to enhance residual layer thickness uniformity

Hayden Taylor, Kristian Smistrup, Duane Boning

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 463 KB

english, 2011

14

Multistrata Subsurface Laser-Modified Microstructure With Backgrind-Assisted Controlled Fracture for Defect-Free Ultrathin Die Fabrication

Weng Hong Teh,, Boning, Duane S., Welsch, Roy E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 5.83 MB

english, 2015

15

SPIE Proceedings [SPIE Smart Materials, Nano-and Micro-Smart Systems - Melbourne, Australia (Tuesday 9 December 2008)] Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems IV - Modeling pattern dependencies in the micron-scale embossing of polymeric layers

Taylor, Hayden, Chiao, Jung-Chih, Hariz, Alex J., Iliescu, Ciprian, Ni, Ming, Thiel, David V., Yang, Changyi, Xing, Chen, Lam, Yee Cheong, Boning, Duane

Year:

2008

Language:

english

File:

PDF, 2.98 MB

english, 2008

16

A matrix math library for Java

Smith, Taber H., Gower, Aaron E., Boning, Duane S.

Journal:

Concurrency Practice and Experience

Year:

1997

Language:

english

File:

PDF, 147 KB

english, 1997

17

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California (Sunday 21 February 2010)] Design for Manufacturability through Design-Process Integration IV - Towards nanoimprint lithography-aware layout design checking

Taylor, Hayden, Boning, Duane, Rieger, Michael L., Thiele, Joerg

Year:

2010

Language:

english

File:

PDF, 1.10 MB

english, 2010

18

[IEEE 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Saratoga Springs, NY, USA (2017.5.15-2017.5.18)] 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Spin coating modeling and planarization using fill patterns for advanced packaging technologies

Lang, Christopher, Boning, Duane

Year:

2017

Language:

english

File:

PDF, 514 KB

english, 2017

19

Machine Learning in VLSI Computer-Aided Design || SiLVR: Projection Pursuit for Response Surface Modeling

Elfadel, Ibrahim M., Boning, Duane S., Li, Xin

Year:

2019

Language:

english

File:

PDF, 1.38 MB

english, 2019

20

Simultaneous Fault Detection and Classification for Semiconductor Manufacturing Tools

Goodlin, Brian E., Boning, Duane S., Sawin, Herbert H., Wise, Barry M.

Journal:

Journal of The Electrochemical Society

Year:

2003

Language:

english

File:

PDF, 421 KB

english, 2003

21

A Method for Direct Measurement of Substrate Temperature during Copper CMP

Sampurno, Yasa A., Borucki, Leonard, Zhuang, Yun, Boning, Duane, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2005

Language:

english

File:

PDF, 1.11 MB

english, 2005

22

SPIE Proceedings [SPIE Microelectronic Manufacturing 1996 - Austin, TX (Wednesday 16 October 1996)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II - Statistical metrology: understanding spatial variation in semiconductor manufacturing

Boning, Duane S., Chung, James E., Keshavarzi, Ali, Prasad, Sharad, Hartmann, Hans-Dieter

Year:

1996

Language:

english

File:

PDF, 930 KB

english, 1996

23

Characterization and Modeling of Pad Asperity Response in CMP

Boning, Duane, Fan, Wei

Journal:

MRS Proceedings

Year:

2010

Language:

english

File:

PDF, 183 KB

english, 2010

24

[IEEE 2014 IEEE International Ultrasonics Symposium (IUS) - Chicago, IL, USA (2014.9.3-2014.9.6)] 2014 IEEE International Ultrasonics Symposium - Towards wireless capsule endoscopic ultrasound (WCEU)

Lee, John H., Traverso, Giovanni, Schoellhammer, Carl M., Blankschtein, Daniel, Langer, Robert, Thomenius, Kai E., Boning, Duane S., Anthony, Brian W.

Year:

2014

Language:

english

File:

PDF, 712 KB

english, 2014

25

SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Wednesday 1 October 1997)] Microelectronic Device Technology - Wafer-scale modeling of pattern effect in oxide chemical mechanical polishing

Ouma, Dennis O., Stine, Brian, Divecha, Rajesh, Boning, Duane S., Chung, James E., Shinn, Gregory B., Ali, Iqbal, Clark, John, Rodder, Mark, Tsuchiya, Toshiaki, Burnett, David, Wristers, Dirk

Year:

1997

Language:

english

File:

PDF, 492 KB

english, 1997

26

Damascene Chemical-Mechanical Polishing Characterization and Modeling for Polysilicon Microelectromechanical Systems Structures

Tang, Brian D., Xie, Xiaolin, Boning, Duane S.

Journal:

Journal of The Electrochemical Society

Year:

2005

Language:

english

File:

PDF, 1.23 MB

english, 2005

27

SPIE Proceedings [SPIE SPIE Optical Engineering + Applications - San Diego, California, United States (Sunday 9 August 2015)] Image Reconstruction from Incomplete Data VIII - Alternative techniques for high-resolution spectral estimation of spectrally encoded endoscopy

Bones, Philip J., Fiddy, Michael A., Millane, Rick P., Mousavi, Mahta, Duan, Lian, Javidi, Tara, Ellerbee, Audrey K.

Year:

2015

Language:

english

File:

PDF, 4.74 MB

english, 2015

28

Re-Examining The Physical Basis of Pattern Density and Step Height CMP Models

Xie, Xiaolin, Park, Tae, Lee, Brian, Tugbawa, Tamba, Cai, Hong, Boning, Duane

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 425 KB

2003

29

Characterizing and Predicting Spatial Nonuniformity in the Deep Reactive Ion Etching of Silicon

Taylor, Hayden K., Sun, Hongwei, Hill, Tyrone F., Farahanchi, Ali, Boning, Duane S.

Journal:

Journal of The Electrochemical Society

Year:

2006

Language:

english

File:

PDF, 513 KB

english, 2006

30

[IEEE 2008 IEEE Asian Solid-State Circuits Conference (A-SSCC) - Fukuoka, Japan (2008.11.3-2008.11.5)] 2008 IEEE Asian Solid-State Circuits Conference - An all-digital, highly scalable architecture for measurement of spatial variation in digital circuits

Drego, Nigel, Chandrakasan, Anantha, Boning, Duane

Year:

2008

Language:

english

File:

PDF, 223 KB

english, 2008

31

Slurry Particle Agglomeration Model for Chemical Mechanical Planarization (CMP)

Johnson, Joy Marie, Boning, Duane

Journal:

MRS Proceedings

Year:

2010

Language:

english

File:

PDF, 271 KB

english, 2010

32

A 12b 250 MS/s Pipelined ADC With Virtual Ground Reference Buffers

Boo, Hyun H., Boning, Duane S., Lee, Hae-Seung

Journal:

IEEE Journal of Solid-State Circuits

Year:

2015

Language:

english

File:

PDF, 1.55 MB

english, 2015

33

[IEEE Conference Publications Design, Automation and Test in Europe - Grenoble, France (2015.03.9-2015.03.13)] Design, Automation & Test in Europe Conference & Exhibition (DATE), 2015 - Statistical Library Characterization using Belief Propagation across Multiple Technology Nodes

Yu, Li, Saxena, Sharad, Hess, Christopher, Elfadel, Ibrahim (Abe) M., Antoniadis, Dimitri, Boning, Duane

Year:

2015

Language:

english

File:

PDF, 352 KB

english, 2015

34

[IEEE 2012 IEEE International Conference on IC Design & Technology (ICICDT) - Austin, TX, USA (2012.05.30-2012.06.1)] 2012 IEEE International Conference on IC Design & Technology - Spatial variation decomposition via sparse regression

Zhang, Wangyang, Balakrishnan, Karthik, Li, Xin, Boning, Duane, Acar, Emrah, Liu, Frank, Rutenbar, Rob A.

Year:

2012

Language:

english

File:

PDF, 2.39 MB

english, 2012

35

SPIE Proceedings [SPIE Photonics East '96 - Boston, MA (Monday 18 November 1996)] Open Architecture Control Systems and Standards - Flexible distributed architecture for semiconductor process control and experimentation

Gower, Aaron E., Boning, Duane S., McIlrath, Michael B., Proctor, Frederick M.

Year:

1997

Language:

english

File:

PDF, 299 KB

english, 1997

36

SPIE Proceedings [SPIE Microelectronic Manufacturing 1996 - Austin, TX (Wednesday 16 October 1996)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II - Inter- and intra-die polysilicon critical dimension variation

Stine, Brian, Boning, Duane S., Chung, James E., Bell, David A., Equi, Edward, Keshavarzi, Ali, Prasad, Sharad, Hartmann, Hans-Dieter

Year:

1996

Language:

english

File:

PDF, 562 KB

english, 1996

37

[IEEE 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Saratoga Springs, NY, USA (2018.4.30-2018.5.3)] 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Modelling pattern dependent variations in semi-additive copper electrochemical plating: AP/DFM: Advanced patterning / design for manufacturability

Lang, Christopher, Boning, Duane

Year:

2018

Language:

english

File:

PDF, 943 KB

english, 2018

38

Sa1964 Gastric Cancer Chemoprevention by Phenethyl Isothiocyanate-Containing Diet in Chemically – but Not Genetically – Induced Gastric Cancer in Mice

Øverby, Anders, Zhao, Chun-Mei, Wang, Timothy C., Bones, Atle, Chen, Duan

Journal:

Gastroenterology

Year:

2014

Language:

english

File:

PDF, 45 KB

english, 2014

39

[ACM Press the 21st edition of the great lakes symposium - Lausanne, Switzerland (2011.05.02-2011.05.04)] Proceedings of the 21st edition of the great lakes symposium on Great lakes symposium on VLSI - GLSVLSI '11 - Redundancy in SAR ADCs

Chang, Albert H., Lee, Hae-Seung, Boning, Duane S.

Year:

2011

Language:

english

File:

PDF, 1.86 MB

english, 2011

40

[IEEE 2015 IEEE International Ultrasonics Symposium (IUS) - Taipei, Taiwan (2015.10.21-2015.10.24)] 2015 IEEE International Ultrasonics Symposium (IUS) - Ultrasound image-based absolute concentration measurement technique for materials with low scatterer concentration

Lee, John H., Jimenez, Javier, Xiang Zhang,, Boning, Duane S., Anthony, Brian W.

Year:

2015

Language:

english

File:

PDF, 2.87 MB

english, 2015

41

Changes in the Editorial Board

Boning, Duane S.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2008

Language:

english

File:

PDF, 220 KB

english, 2008

42

2006 Best Paper Award

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2007

Language:

english

File:

PDF, 671 KB

english, 2007

43

Modeling of Pattern Dependencies for Multi-Level Copper Chemical-Mechanical Polishing Processes

Tugbawa, Tamba, Park, Tae, Lee, Brian, Boning, Duane

Journal:

MRS Proceedings

Year:

2001

Language:

english

File:

PDF, 41 KB

english, 2001

44

SPIE Proceedings [SPIE SPIE Optical Engineering + Applications - San Diego, California, USA (Sunday 12 August 2012)] Image Reconstruction from Incomplete Data VII - Effects of extraneous noise in cryptotomography

Loh, N. Duane, Bones, Philip J., Fiddy, Michael A., Millane, Rick P.

Year:

2012

Language:

english

File:

PDF, 473 KB

english, 2012

45

Wafer Scale Variation of Planarization Length in Chemical Mechanical Polishing

Oji, Charles, Lee, Brian, Ouma, Dennis, Smith, Taber, Yoon, Jung, Chung, James, Boning, Duane

Journal:

Journal of The Electrochemical Society

Year:

2000

Language:

english

File:

PDF, 495 KB

english, 2000

46

[IEEE 2020 57th ACM/IEEE Design Automation Conference (DAC) - San Francisco, CA, USA (2020.7.20-2020.7.24)] 2020 57th ACM/IEEE Design Automation Conference (DAC) - Wafer Map Defect Patterns Classification using Deep Selective Learning

Alawieh, Mohamed Baker, Boning, Duane, Pan, David Z.

Year:

2020

File:

PDF, 978 KB

2020

47

Large-area and high-resolution distortion measurement based on moiré fringe method for hot embossing process

Xu, Zhiguang, Taylor, Hayden K., Boning, Duane S., Yoon, Soon Fatt, Youcef-Toumi, Kamal

Journal:

Year:

2009

Language:

english

File:

PDF, 1.49 MB

english, 2009

48

Variation

Boning, Duane S., Balakrishnan, Karthik, Cai, Hong, Drego, Nigel, Farahanchi, Ali, Gettings, Karen M., Lim, Daihyun, Somani, Ajay, Taylor, Hayden, Truque, Daniel, Xie, Xiaolin

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2008

Language:

english

File:

PDF, 2.28 MB

english, 2008

49

[IEEE 2015 IEEE International Ultrasonics Symposium (IUS) - Taipei, Taiwan (2015.10.21-2015.10.24)] 2015 IEEE International Ultrasonics Symposium (IUS) - Measurement of very low concentration of microparticles in fluid by single particle detection using acoustic radiation force induced particle motion

Lee, John H., Jimenez, Javier, Butterworth, Ian R., Castro-Gonzalez, Carlos, Shukla, Shiva K., Marti-Fuster, Berta, Elvira, Luis, Boning, Duane S., Anthony, Brian W.

Year:

2015

Language:

english

File:

PDF, 1.46 MB

english, 2015

50

Direct Measurement of Planarization Length for Copper Chemical Mechanical Planarization Polishing (CMP) Processes Using a Large Pattern Test Mask

Lefevre, Paul, Gonzales, Albert, Brown, Tom, Martin, Gerald, Tugbawa, Tamba, Park, Tae, Boning, Duane, Gostein, Michael, Nguyen, John

Journal:

MRS Proceedings

Year:

2001

Language:

english

File:

PDF, 167 KB

english, 2001

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